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» Allan Kraus
» Anant Setlur
» Ankur Srivastava
» Bahgat Sammakia
» Bao Yang
» Clemens Lasance
» Dereje Agonafer
» Emad Samadiani
» Gary L. Solbrekken
» Joseph Shiang
» Karl JL Geisler
» Mehmet Arik
» Mohd Nabil Sabry
» Peng Wang
» Peter Rodgers
» Sachin Sapatnekar
» Stanton Weaver
» Suresh Garimella
» Tannaz Harirchian
» Yogendra Joshi
» Yufu Zhang
» Yuan Cheng Lee
» Valérie Eveloy
Allan Kraus Throughout his career Kraus has been indefatigable in his efforts on behalf of the profession and fellow engineers. In the mid-1990s Kraus held one of the highest offices in ASME, serving on the prestigious Board of Governors. Kraus received the American Society of Mechanical Engineers (ASME) Memorial Heat Transfer Award in 1969, the ASME Worcester Reed Warner Medal in 1983, and ASME Honorary Membership in 1986. In 1997 he received the Donald Q. Kern Award from the AIChE society and in 1998 the ASME Edwin F. Church Medal. He has also served as a founding Executive Committee member of the ASME Electronic Packaging Division, as an Associate Editor of the Journal of Heat Transfer, and as an Associate Editor of the IEEE CPMT Transactions.
Anant Setlur Dr. Anant Setlur received a S.B. in 1994 from M.I.T and a Ph.D. in 1999 from Northwestern both in materials science and engineering. He joined GE Global Research (GEGR) in 1999 as a materials scientist where he has worked on the development of inorganic luminescent materials (e.g. phosphors and scintillators) for lighting and medical applications. He has also served as chairman of the Luminescence and Display division of the Electrochemical Society and has been on DOE committees to determine the research and product development goals for DOE solid-state lighting programs. Dr. Setlur has over 40 publications/conference proceedings and 56 issued U.S. patents.
Ankur Srivastava Dr Ankur Srivastava is an associate professor at the University of Maryland College Park in the Electrical and Computer Engineering department with a joint appointment with the Institute for Systems Research. He received his bachelors in technology from the Indian Institute of Technology Delhi in May 1998 with Electrical Engineering major, Masters in Computer Engineering in June 2000 from department of ECE Northwestern University and PhD from CS department of University of California Los Angeles in September 2002. His main area of interest is design methods and runtime control policies for high performance, low energy, low temperature and low power multi-core processors and other VLSI circuits. He is the recipient of the "Outstanding PhD Award" from the Computer Science Department of UCLA and the George Corcoran Memorial Outstanding Teaching Award by the ECE department of University of Maryland. He has been working at the University of Maryland since October 2002.
Ankur's homepage can be found at http://www.ece.umd.edu/~ankurs
Bahgat Sammakia Bahgat Sammakia, a distinguished professor of mechanical engineering, is the interim vice president for research at Binghamton University. A former IBM senior technical staff member, Sammakia joined Binghamton's faculty in 1998. He is the founding director of the Small Scale Systems Integration and Packaging Center, a New York State Center of Excellence, and is the director of the Energy Efficient Electronic Systems Center, an NSF IUCRC founded in 2011 with a focus on reducing the energy consumed by data centers around the world. Sammakia earned his bachelor's degree from the University of Alexandria in Egypt and his master's and doctoral degrees from the University at Buffalo. He is a fellow of the American Society of Mechanical Engineers and a senior IEEE member. Sammakia, editor of the ASME Journal of Electronic Packaging, holds 15 U.S. patents and has published more than 180 peer-reviewed technical papers. Sammakia, who received the Chancellor's Award for Excellence in Scholarship and Creative Activities in 2010, was honored with the 2012 Thermi Award for his contributions to the field of semiconductor thermal management.
Bao Yang Professor Yang is an Associate Professor in the Department of Mechanical Engineering at the University of Maryland performing research in nanoengineered fluids, thermal management, thermoelectrics and renewable energy. Dr. Yang received a Ph.D. in Physics from the University of Science and Technology of China in 1998 and another Ph.D. in Mechanical Engineering from the University of California Los Angeles in 2003. After a one-year Research Assistantship at MIT, Dr. Yang joined UMD in 2003. Dr. Yang was granted the Ralph Powe Junior Faculty Enhancement Award in 2004. Dr. Yang is a member of ASME, MRS, APS, ITS and AIAA.
Bao Yang's homepage can be found at http://www.enme.umd.edu/facstaff/fac-profiles/yang.html
Clemens Lasance Clemens Lasance, retired in September 2009, was a Principal Scientist at Philips Research in the Netherlands. He published over 80 conference and journal papers. He is an editor of ElectronicsCooling since its start in 1995. He received the SEMITHERM Significant Contributor Award in 2001, the Harvey Rosten Award for recognition of his pioneering contributions in 2006, and the Best Paper Award at Semitherm in 1995 and 2009. He is still active through his consultancy SomelikeitCool, as a presenter of courses, leading author of a Compact Thermal Modeling book, and editor/author of a book on thermal management of LED applications.
Clemens' LinkedIn account can be found at http://www.linkedin.com/profile/view?id=5389926&trk=tab_pro
Dereje Agonafer Brief Bio:
Dr. Agonafer is the Jenkins Garrett Professor in Mechanical and Aerospace Engineering. He heads two centers: Site Director of NSF IUCRC in Energy Efficient Systems and Director of Electronics, MEMS and Nanoelectronic Systems Packaging Center. After receiving a PhD from Howard University in 1984, he joined IBM where he became the IBM Center of Competence for Computer Aided Thermal Engineering where he worked in promoting a concurrent engineering methodology for thermo/mechanical design and modeling of electronic packaging. In 1991, the value of his contribution to "Computer Aided Thermal Engineering" was recognized by being awarded the "IBM Outstanding Technical Achievement Award in Appreciation for Computer Aided Thermal Modeling." In 1997, he was a co-inventor of a patent application entitled "Methods and system for thermal analysis of electronic packages." Since joining UTA in 1999, he has successfully advised over seventy graduate students and currently advises 10PhDs and 16MSc students. His recent focus has been on data center cooling (center) and 3D packaging/cooling (patents filed). Professor Agonafer serves on the Scientific Advisory Board of a NSF Center, Mid-Infrared Technologies for Health and the Environment (MIRTHE) at Princeton University since 2007. He also serves on the Dean's Engineering Advisory Committee at both University of Colorado and Howard University. Professor Agonafer has published over 150 papers and 8 issued patents (with several pending), He is a Fellow of The American Society of Mechanical Engineers International (ASME) and Fellow of The American Association for the Advancement of Science (AAAS). He has received numerous awards including the 2008 Thermi Award at the 24th Annual Semi-Therm and the 2009 InterPACK Excellence Award. Professor Agonafer was at MIT as a Dr. Martin Luther King, Jr. Visiting Professor during the 2007 academic year.
Emad Samadiani Biography:
Emad Samadiani is a Visiting Research Assistant Professor at Binghamton University, working in Small Scale Systems Integration & Packaging Center. He received his PhD in Mechanical Engineering from Georgia Institute of Technology in August 2009. Before joining BU, he was a post-doctoral fellow at Georgia Tech. His research interests are in computational and reduced order modeling methods for energy efficient electronics and data center thermal management at various scales. He has co-authored over 15 journal and peer reviewed conference papers, one of which has received best-paper award from ASME.
Gary L. Solbrekken Gary L. Solbrekken is the director of undergraduate studies and an associate professor in the Mechanical and Aerospace Engineering Department at the University of Missouri. He previously managed a thermal laboratory for Intel Corp. and holds four patents in the area of thermal management. His projects have been funded by Intel, W.L. Gore and Associates, Argonne National Lab, the National Science Foundation, the National Institutes of Health, Y-12 National Security Complex and MU. He is collaborating with the Veterinary School on tissue cryopreservation and with the University of Missouri Research Reactor on target design.
Gary's homepage can be found at http://engineering.missouri.edu/person/solbrekkeng/
Joseph Shiang Dr. Joseph Shiang holds a Ph.D. in Chemistry from the University of California, Berkeley, 1994. Since joining the GE Global Research in 1999, Dr. Shiang has worked on the development and optical modeling of both organic light emitting devices and scintillators. Prior to joining GE, Dr. Shiang was a post-doctoral fellow at UCLA (1995-1997) working on nanoscale inorganic materials, and at the University of Michigan (1997-1999) studying chemical dynamics using femto-second spectroscopies. He is an author on over 35 technical publications and an inventor for over 30 issued US patents.
Karl JL Geisler Karl JL Geisler is currently in 3M's Display and Graphics Business Laboratory, developing thermal management solutions for solid-state lighting. Previously he worked in product development, thermal packaging, and thermomechanical reliability at General Dynamics Advanced Information Systems. He has authored 5 book chapters, 3 archival journal papers, and 16 conference papers. He received PhD and MS degrees in Mechanical Engineering from the University of Minnesota, Twin Cities and a BA in Physics from Lawrence University of Appleton, Wisconsin. Dr. Geisler has served as an adjunct professor at the University of Minnesota and is a member of ASME and IEEE.
Karl's LinkedIn page can be found at http://www.linkedin.com/in/karlgeisler/
Mehmet Arik Dr. Mehmet Arik obtained his BSc degree in mechanical engineering from Istanbul Technical University, Istanbul. He completed MSc degree at the University of Miami, Miami, in 1996. His master thesis was on the Single Phase Forced Convection Turbulent Flow in Rectangular Channels. His PhD degree was awarded at the University of Minnesota, focusing on the thermal management of high flux electronic components and Microelectromechanical systems (MEMS), in 2001. He has started working at the General Electric Global Research Center in Niskayuna, NY, on the thermal management of electronics as a senior research scientist and project leader in 2000. He has performed research in air-cooled and liquid cooled power electronics, photonics packages, microfluidic systems, defense systems, energy technologies and medical systems. Dr. Arik is an associate professor at Ozyegin University in Istanbul, Turkey. His current research intrests include electronics cooling, microfluidics devices, energy, medical, defense systems, and Six Sigma. He is a member of ASME and IEEE. He is an ASME fellow. He holds over thirty five US patents and many more are pending. He published over 80 papers in international journals and conferences in the fields of electronics cooling, energy systems, and MEMS.Dr Arik serves as associate editor for both IEEE Components and Packaging Techonlogies and ASME Thermal Sc?ences and Engineering Applications journals.
Mohd Nabil Sabry Prof. Mohamed Nabil Sabry, born in Cairo, Egypt, 1953 is actually the founding director, of Mansoura Nanotechnology Center, Egypt. He holds a Doctorat s Sciences degree, INPG, France 1984 and an Engineering Degree with honors, Ain Shams Egypt 1976. He has over 40 international publications and is an associate Editor in IEEE/CPT, ASME/JHT and ASME/JEP. He has received the Harvey Rosten Award of excellence in electrothermal analysis. He is the Chairman of ThETA international conference series. He was formerly the Engineering Manager of Analog and Mixed Signal Simulation Tools, Mentor Graphics. His areas of interest include Modeling and simulation of electro-thermal effects (transistor to system levels), large analog electronic circuits and fluid and heat transfer in nanodevices
Peng Wang Dr. Peng Wang is a research scientist at the University of Maryland. Previously, he worked as a thermal packaging consultant to develop thermal management strategies for electronics and telecommunications companies. Since 2000 his work has been concentrated in advanced cooling technologies for chip-level, package-level, and system-level thermal management of electronics. His experience includes air cooling, solid state cooling, liquid cooling, two-phase evaporative cold plate, thermosyphon, and heat pipe for high power electronics. He received his Ph.D. in mechanical engineering from the University of Maryland at College Park in 2007. He is a member of ASME and senior member of IEEE.
Peter Rodgers Peter Rodgers is an Associate Professor of Mechanical Engineering at The Petroleum Institute in Abu Dhabi, United Arab Emirates. He holds a Ph.D. degree in mechanical engineering from the University of Limerick, Ireland. He was formally with the Center for Advanced Life Cycle Engineering (CALCE), University of Maryland; Nokia Research Center, Finland and Electronics Thermal Management, Ltd., Ireland. In these positions he has been actively involved in electronics cooling and reliability, including health monitoring of electronics. He has authored or co-authored over 80 journal and conference publications in these areas. He has served as an invited lecturer, keynote speaker, panelist, and session chair at international conferences and received the 1999 Harvey Rosten Memorial Award for his publications on the application of computational fluid dynamics to electronics thermal design. He is a member of several international conference program committees focused on energy technologies, electronics reliability and thermal phenomena in electronic systems. His present research activities are focused on the development of polymeric heat exchangers; solid particle transport in multiphase flow; waste heat utilization; solar energy; experimental characterization of fundamental thermofluid phenomena; and engineering education.
Rodgers' homepage can be found at http://www.pi.ac.ae/PI_ACA/me/faculty_staff/prodgers.php
Sachin Sapatnekar Sachin Sapatnekarreceived his Ph.D. from the University of Illinois at Urbana-Champaign in 1992. He is currently at the University of Minnesota, where he holds the Distinguished McKnight University Professorship and the Henle Professorship in ECE. His research is related to developing CAD techniques for the analysis and optimization of circuit performance. He has served as General Chair for the ACM/IEEE Design Automation Conference (DAC) and is currently Editor-in-Chief of the IEEE Transactions on CAD. He is a recipient of the NSF Career Award, six conference Best Paper awards, and the SRC Technical Excellence award, and is a fellow of the IEEE.
Sachin Sapatnekar homepage can be found at http://www.umn.edu/~sachin
Stanton Weaver Mr. Stanton E. Weaver Jr., Packaging Engineer Mr. Weaver is a senior scientist with a background in electronics and has more than twenty-five years experience at GE Global Research. He has worked on and led a variety of electronics projects, including high density, multi-chip electronic packaging; design and construction of state-of-the-art direct laser write and drill machines; high power LED package development; harsh environment electronics packaging, solid-state cooling utilizing hot electron tunneling and high performance heat pipes. His customers have included internal GE businesses, DARPA, DOE, DOD and NIST. He has published more than fifty technical papers and holds thirty-nine US issued patents.
Suresh Garimella Dr. Suresh Garimella is the R. Eugene and Susie E. Goodson Distinguished Professor of Mechanical Engineering, Associate Vice President for Engagement at Purdue University, and Director of the Cooling Technologies Research Center, a National Science Foundation IUCRC. Dr. Garimella served as a Jefferson Science Fellow at the U.S. Department of State last year and is currently serving as a Senior Fellow for the Energy and Climate Partnership of the Americas (ECPA). Dr. Garimella has published over 450 refereed journal and conference papers, and his efforts have been recognized with the 2011 NSF Alexander Schwarzkopf Prize for Technological Innovation, the 2010 ASME Heat Transfer Memorial Award, the 2010 IIT Madras Distinguished Alumnus Award, the 2009 ASME Allan Kraus Thermal Management Award, and the 2004 ASME Gustus L. Larson Memorial Award, among others.
Suresh's homepage can be found at https://engineering.purdue.edu/~sureshg
Tannaz Harirchian Dr. Harirchian received the 2009 Harvey Rosten Award for Excellence in Design of Electronics, and the 2009 EPPD Student Member Award from the Electronics and Photonics Packaging Division of the IEEE/ASME. She has coauthored 17 articles in peer-reviewed journals and conference proceedings and has been an invited speaker in international conferences. She has served as a reviewer for a number of journals and conferences, and is on the program committee of iMAPS (International Microelectronics and Packaging Society) Advanced Technology Workshop on Thermal Management. In 2011, Dr. Harirchian joined Intel Corporation as a Packaging Engineer, where she is currently involved with the research and development of thermal packaging and cooling systems for electronic components and systems.
Yogendra Joshi Yogendra Joshi is Professor and John M. McKenney and Warren D. Shiver Distinguished Chair at the G.W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology. His research interests are in multi-scale thermal management. He received a Bachelor of Technology degree in Mechanical Engineering from the Indian Institute of Technology in Kanpur in 1979, Master of Science in Mechanical Engineering from the State University of New York, Buffalo in 1981, and a Doctor of Philosophy in Mechanical Engineering and Applied Mechanics, from the University of Pennsylvania in 1984. He is the author or co-author of over 260 archival journal and conference publications, and is an elected Fellow of the ASME, the American Association for the Advancement of Science, and IEEE. He has advised or co-advised 20 Ph.D. students and 44 M.S. students. He has served as Associate Editor for the ASME J. of Electronics Packaging (two terms) and the ASME J. Heat Transfer, and is currently an Associate Editor for the IEEE Transactions in Components and Packaging Technologies. He was a co-recipient of ASME Curriculum Innovation Award (1999), Inventor Recognition Award from the Semiconductor Research Corporation (2001), the ASME Electronic and Photonic Packaging Division Outstanding Contribution Award in Thermal Management (2006), ASME J. of Electronics Packaging Best Paper of the Year Award (2008), IBM Faculty Award (2008), IEEE Semitherm Significant Contributor Award (2009), IIT Kanpur Distinguished Alumnus Award (2011), and ASME InterPack Achievement Award (2011).
Yufu Zhang Yufu Zhang's research interest lie in Power estimation and optimization; Temperature management for multi-core processors; Variation-aware VLSI design approaches; DFM (design for manufacturability), RET, OPC; Parallel computing; data mining and machine learning techniques.
yuan-cheng-lee Dr. Yuan Cheng Lee received his BSME degree from the National Taiwan University in 1978 and Ph.D. from the University of Minnesota in 1984. He is the S. J. Archuleta Professor at the Department of Mechanical Engineering, University of Colorado Boulder (CU-Boulder). From 2006 to 2012, he served as the Director of the DARPA Center for Integrated Micro/Nano-Electromechanical Transducers (iMINT) and the Administrative Director of the Nanomaterials Characterization Facility hosted by CU-Boulder. From 1993 to 2002, he served as an Associate Director of the NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics (CAMPmode), CU-Boulder. Prior to joining the University in 1989, he was a Member of Technical Staff at AT&T Bell Laboratories, Murray Hill, New Jersey. Dr. Lee was an Associated Editor of the ASME Journal of Electronic Packaging from 2001 to 2004 and a Guest Editor for the IEEE Transaction on Advanced Packaging in 2003, 2005 and 2007. Dr. Lee served as the Technical Program Chair of InterPACK 1997 and 1999 and the General Chair of InterPACK 2001. He was the Chair of ASME Electronic and Photonic Packaging Division (EPPD) from 2004 to 2005. Dr. Lee is recognized for his research contributions in packaging and interconnect for microsystems integrating microelectronic, optoelectronic, microwave, microelectromechanical and nanoelectromechanical devices. In addition, he has managed three major projects funded by DARPA with over 15 faculty, 100 students/post-docs and 20 industrial representatives participated from 2006 to 2012.
Dr. Lee has received the following awards: 1) Presidential Young Investigator (National Science Foundation, 1990); 2) Outstanding Young Manufacturing Engineer Award (SME, 1992); 3) Outstanding Paper Award (IEEE-ECTC, 1991); 4) Outstanding Paper Award (ASME J. of Electronic Packaging, 1993); 5) ASME Fellow (2002); 6) CU-ME Woodward Outstanding Mechanical Engineering Faculty Award, 2005-2006; and 7) ASME Electronic and Photonic Packaging Division's Mechanics Award in 2007.
Valerie Eveloy Valérie Eveloy is an Associate Professor in mechanical engineering specialized in thermofluids at The Petroleum Institute, United Arab Emirates. She holds a Ph.D. in mechanical engineering from Dublin City University, Ireland, awarded for an experimental assessment of computational fluid dynamics predictive accuracy for electronic component heat transfer, and a M.Sc. from the National Institute of Applied Science (INSA), France. Her present research interests include solid oxide fuel cells and solar photovoltaics for power generation in the oil and gas industry, waste heat utilization in oil and gas facilities, computational fluid dynamics, microfluidics with applications in the petrochemical industry, and engineering education. Prior to joining the Petroleum Institute, she was with the CALCE EPSC at the University of Maryland, USA; several divisions of Nokia, including Nokia Research Center, Finland; and Electronics Thermal Management, Ireland. She has over eighteen years experience in areas including electronic equipment thermal management and reliability, integrated circuit packaging, human health monitoring, computational fluid dynamics, and biomedical human health monitoring. She has authored or co-authored over 70 refereed journal and conference publications and one book chapter, and is a co-editor of both the First and Second International Energy 2030 Conference proceedings. Dr. Eveloy is a member of several international conference program committees focused on energy technologies, electronics reliability and thermal phenomena in electronic systems. Dr. Eveloy is a member of ASME.
Eveloy's homepage can be found at http://www.pi.ac.ae/PI_ACA/me/faculty_staff/veveloy.php
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