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Chief Editors
Dr. Avram Bar-Cohen Dr. Avram Bar-Cohen is an internationally recognized leader in the development and application of thermal science and engineering to microelectronic and optoelectronic systems. In his current role at the Defense Advanced Projects Agency (DARPA) and through his professional service in IEEE and ASME, he has helped to define and guide the development of thermal packaging science and technology and facilitated the emergence of high reliability consumer electronics, computing platforms, and microwave communication and radar systems. His research and publications, as well as short courses, tutorials, and keynote lectures, on air-cooled card cages and heat sinks, along with direct liquid cooling of microprocessors and RF components, have helped to create the scientific foundation for the thermal management of micro- and nano-electronic components and systems.

Bar-Cohen is an Honorary member of ASME and Fellow of IEEE, as well as Distinguished University Professor in the Department of Mechanical Engineering at the University of Maryland. From 2001 to 2010 he served as the Chair of Mechanical Engineering at Maryland. His honors include the Luikov Medal from the International Center for Heat and Mass Transfer in Turkey (2008), ASME's Heat Transfer Memorial Award (1999), Curriculum Innovation Award (1999), Edwin F. Church Medal (1994), Worcester Reed Warner Medal (2000), and the Electronic and Electrical Packaging Division's Outstanding Contribution Award (1994) as well as the InterPack Achievement Award (2007). Bar-Cohen was the founding chair of the IEEE Intersociety Conference on Thermal Management in Electronic Equipment (ITHERM) in 1988 and was recognized with the IEEE CPMT Society's Outstanding Sustained Technical Contributions Award (2002), the ASME/IEEE ITHERM Achievement Award (1998) and the THERMI Award from the IEEE/Semi-Therm Conference (1997). From 1998 to 2001 he directed the University of Minnesota Center for the Development of Technological Leadership and held the Sweatt Chair in Technological Leadership.

Bar-Cohen has begun a 3-year term on the CPMT Board of Governors since January 2012. He is also the recipient of the 2014 IEEE CPMT Award

Dr Ricky Lee Dr Ricky Lee received his PhD degree from Purdue University in 1992. He joined the Hong Kong University of Science & Technology (HKUST) in 1993. During his career of tenure-track faculty at HKUST, Dr Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute (NAMI) for two and a half years. Currently Dr Lee is Professor of Mechanical Engineering and Director of Center for Advanced Microsystems Packaging (CAMP) at HKUST. He also has a concurrent appointment as Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China. Due to his technical contributions, Dr Lee received many honors and awards over the years. In addition to being the recipient of nine best/outstanding paper awards and three major professional society awards, Dr Lee is Fellow of IEEE, ASME, and Institute of Physics (UK). He is also a Distinguished Lecturer of the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society. Furthermore, Dr Lee was elected President of IEEE CPMT Society in 2011 and is serving for the term of 2012-2013. He is also the recipient of the 2014 David Feldman Outstanding Contribution Award.
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