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About the Encyclopedia of Thermal Packaging
Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems — are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.

Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.

The first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology "building blocks", such as microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These "building blocks" are the essential elements in the creation of a complete, cost-effective thermal management system.

The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to experimental characterization, the thermal design of solid state lighting systems, development and use of compact models and thermally-informed electronic design.

 
  Set 1: Thermal Packaging Techniques
The books included in "Set 1: Thermal Packaging Techniques" focus on the technology "building blocks" used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual "building blocks" and their insertion in the overall thermal solution.

Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, and thermoelectric microcoolers.

Volume 1: Microchannel Heat Sinks for Electronics Cooling
Suresh V Garimella & Tannaz Harirchian [Purdue University, USA]
Volume 2: Air- and Liquid-Cooled Cold Plates
Allan Kraus [Kraus Associates, USA]
Volume 3: Dielectric Liquid Cooling of Immersed Components
Karl Geisler [3M Center, USA] & Avram Bar-Cohen [University of Maryland, USA]
Volume 4: Thermoelectric Microcoolers
Bao Yang & Peng Wang [University of Maryland, USA]
Volume 5: Energy Efficient Solid State Lighting
Mehmet Arik [Ozyegin University, Turkey], Anant Setlur, Stanton Weaver Jr. & Joseph J Shiang [General Electric, USA]
Volume 6: Experimental Thermofluid Characterization of Electronic Components
Gary Solbrekken [University of Missouri at Columbia, USA]]

  Set 2: Thermal Packaging Tools
The books included in "Set 2: Thermal Packaging Tools" focus on the experimental and analytical tools used by practitioners and researchers in this community to accelerate product development and achieve "correct by design" thermal packaging solutions.

Volumes offered in Set 2 of the Thermal Packaging Encyclopedia will deal with experimental characterization, the thermal design of solid state lighting systems, development and use of compact models and thermally-informed electronic design.

Volume 1: Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research
Madhusudan Iyengar [Facebook, USA], Karl J L Geisler [3M, USA] & Bahgat Sammakia [Binghamton University, State University of New York, USA]
Volume 2: Energy Optimization and Thermal Management of Data Centers
Bahgat Sammakia [Binghamton University, State University of New York, USA], Yogendra Joshi [Georgia Tech, USA], Dereje Agonafer [University of Texas, Arlington, USA] & Emad Samadiani [State University of New York, USA]
Volume 3: Compact Thermal Models of Electronic Components
Clemens Lasance [Philips Research Laboratories,The Netherlands] & Mohammed-Nabil Sabry [Mansoura University, Egypt]
Volume 4: Thermally-Informed Design of Microelectronic Components
Sachin Sapatnekar [University of Minnesota, USA], Sachin Sapatnekar [University of Minnesota, USA], Bing Shi [University of Maryland, USA] & Yufu Zhang [University of Maryland, USA]
For more information on the Encyclopedia sets, or to make a purchase, please visit here: Set 1 and
Set 2.


WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING - VOLUME 1
COST ANALYSIS OF ELECTRONIC SYSTEMS
by Peter Sandborn (University of Maryland, USA)

Cost Analysis of Electronic Systems melds elements of traditional engineering economics with manufacturing process and life-cycle cost management concepts to form a practical foundation for predicting the cost of electronic products and systems. Various manufacturing cost analysis methods are addressed including: process-flow, parametric, cost of ownership, and activity-based costing. The effects of learning curves, data uncertainty, test and rework processes, and defects are considered. Aspects of system sustainment and life-cycle cost modeling including reliability (warranty, burn-in), maintenance (sparing and availability), and obsolescence are treated. Finally, total cost of ownership of systems and return on investment are addressed.

To read more or to make a purchase of this Volume, please visit here.


WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING: VOLUME 2
DESIGN AND MODELING FOR 3DICS AND INTERPOSERS
by Madhavan Swaminathan (Georgia Institute of Technology, USA) & Ki Jin Han (Ulsan National Institute of Science and Technology (UNIST), Korea)

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

To read more or to make a purchase of this Volume, please visit here.


WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING: VOLUME 3
Cooling of Microelectronic and Nanoelectronic Equipment
Advances and Emerging Research
edited by Madhusudan Iyengar (Facebook, USA), Karl J L Geisler (3M, USA) & Bahgat Sammakia (Binghamton University, State University of New York, USA)

This unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.

To read more or to make a purchase of this Volume, please visit here.


FORTHCOMING

Wafer Level CSP and Embedded Active Packages
by Jau et al. (Advanced Semiconductor Engineering Inc (ASE), Taiwan)

Thermoelectric Energy Conversion Devices and Systems
by Kazuaki Yazawa and Ali Shakouri (Purdue University, USA)

Additive Manufacturing
by Christopher Bailey (University of Greenwich, UK)

MEMS Packaging
by Y.C. Lee (University of Colorado, USA)

Embedded Passive Technologies in Electronic Packaging
by C. P. Wong (The Chinese University of Hong Kong, Hong Kong), Rong Sun (Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China) &
Shihui Yu (Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China)

Co-Design and Modelling Tools for Advanced Integration and Packaging: Manufacturing and Reliability
by Christopher Bailey (University of Greenwich, UK)

Solder Materials
by Dr Kwang-Lung Lin (National Cheng Kung University, Taiwan)

Temperature Dependence and Power Nonuniformity in Microelectronic Systems
by Dr David Copeland (Oracle, USA)

Solder Joints at Mechanical Shock
by Shi-Wei Ricky Lee (Hong Kong University of Science and Technology, Hong Kong)

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